Overview of the range of our Products

Section

Description

Carbon Graphene Pastes
Carbon Based Pastes for Electrochemistry
Carbon Mediated Pastes for Electrochemistry
Other Carbon Based Systems
Silver Carbon Based Systems
Silver/Silver Chloride Pastes for Electrochemistry
Silver Based Low Temperature Systems
Silver Based Firing Systems
Gold Based High Temperature Cure Systems
Platinum Based Low Temperature Cure Systems
Platinum Based Firing Systems
Alloy Based Firing Systems
Palladium Based Firing Systems
Copper Based Systems Low and High Temperature Cure
Aluminium Based Firing System
High Brightness Phosphor Pastes
Dielectric and Insulating Firing Systems
Insulating Low Temperature Based Systems
Dielectric Low Temperature Based Systems
UV Curable Products
Binder Low Temperature Systems
Paste Systems for Recyclable Substrates

 

*NEW* Carbon Graphene Paste

Section 1

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Curing

Temperature degree C

Properties
C2171023D1 40-42 10-20

<7.5 at 25µm

130 Low resistance, low drying temperature paste for use in printed electronic circuits and electrochemical sensors.

Carbon Based Pastes for Electrochemistry

Section 2

       

Paste

Number

Solids

Content %

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties
C2030519P4 39-43 3.1-5.8 50 at 12µm 60-80 Our standard large scale printing product, offering the best compromise between electrochemical and printing performance. Can be used on PET, PVC, PC.
C2000802P2 39-41 2-3.5 below 50 at 25µm 60-80 The material offers both fine line definition and fast drying advantages.
C2050106P7 38-41 12-15 28 at 25µm 60-80

Good line definition. Application in Medical Diagnostics, DNA Sensors, Lab-on-a-Chip & Environmental Sensors.

C2050517P1 40.6-44.4 3.4-4.6 107 at 24µm 130-150 Thermoset carbon/graphite paste with low hazardous solvents and low co-efficients of variation.
C2100126D6 42-45 9.7-5.1 31-95 at 25µm 130-150 Thermoset paste offering resistance to plar solvents, oftern used with membrance top coats.
C2110309P5 41-42.5 5-8 80 at 14µm 130 Good definition for fine line printing. Low coefficient of variation (CV%).
C2130307D1 39-43 3.1-5.8 <25 at 25µ 60-80 It is designed for use in Electrochemical Impedance Spectroscopy.
C2160602D2 37.3 - 39.7 6.2 - 7.8

<12-18 Ohms/

sq at 25µm

60 Low resistance carbon paste for use in a variety of applications. .
C2130610D1 46.15-47.15 3.1-5.8 <75 at 25µm 60-80 It gives excellent response for heavy metal detection.
C2140423D1 38.0-40.0 3.0-5.0 <60 at 25µm 60-100 Designed to be used in rotary screen printed working electrodes.

Carbon Mediated Pastes for Electrochemistry

Section 3

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Curing

Temperature degree C

Properties
C2030408P3 39-42 2.2-4.3 63 at 12µm 60-80 Cobalt Phtalocyanine modified carbon.
C2070424P2 39-42 2.5-4.5 48 at 14µm 60-80 Prussian Blue mediated carbon paste..
C2170406D4 38-42 2.0-5.5   60-80

Meldola’s blue modified carbon paste. This product is designed for low level concentrations of NADH (0.2mM - 2.0mM).

C2170515D1 38-42 2.0-5.5   60-80

Meldola’s blue modified carbon paste. This product allows a high range of NADH concentrations to be measured (0.4mM - 6.0mM).

C2070508P4 39-43 3.5-4.5 46 at 25µm 60-80 Potassium Ferrocyanide mediated carbon.

Other Carbon Based Systems

Section 4

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq @ 25µm

Curing

Temperature degree C

Properties
C2050503P1 55-49 9.7-5.1 50 at 25µm 150 High conductivity thermoset carbon paste can be used to replace silver in certain applications
C2130819D1 37-41 3.5-5.5

<15 Ohms/

sq at 25µm

60 High conductivity thermoplastic carbon paste can be used as membrane touch switch.
C2130814D2 38-42 7-10

<10 Ohms/

sq at 25µm

130 Screen printable conductive paste for use in a variety of applications (membrane touch switch).
C2030325D14 62-64 17-25 180 at 25µm 180 Thermoset conductive adhesive carbon.
C2040226D2 46-48 5.2 150 at 25µm 150 Thermoset conductive adhesive carbon.
C2040226D4 46-48 4-5 50 at 25µm 150 Thermoset conductive adhesive carbon.
C2050425P1 53.5-54.5 6.5-8.5 120 at 25µm 150 Thermoset conductive adhesive carbon.
C2070920D1 30-33 8-10   150 Thermoset depolymerisable carbon paste..

Silver Carbon Based Systems

Section 5

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq @ 25µm

Curing

Temperature degree C

Properties
C2130715D1 48-50 3.5-6.5 70 at 25µm 130

These pastes are used for printing tracks where a low resistance is needed. These pastes have been developed with a lower silver content to give improved conductivity than a standard Carbon/Graphite Pastes. Applications: smart lables, capacitive switches, flexible electronics.

C2131018D6 48-50 3.5-6.5

145 at 25µm

130
C2130902D4 50-52 6-10

293 at 25µm

130

Silver/Silver Chloride Pastes for Electrochemistry

Section 6

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature degree C

Properties
C2040308P2 81-83 3.5-7.0 640 at 28µm 60-80 Silver:Silver Chloride 40:60
C2131007D3 81-83 3.5-7.0 600 at 23µm 60-80 Silver:Silver Chloride 50:50
C2130809D5 81-83 2-5.5 <100 at 20µm 60-80 Silver:Silver Chloride 60:40
C2030812P3 81-83 3.5-7.0 500 at 16µm 60-80 Silver:Silver Chloride Paste 60:40 slow drying solvents for longer screen life
C2130905D3 81-83 2-5.5 <80 at 18µm 60-80 Silver:Silver Chloride 70:30
C2130102D1 81-83 3.5-7.0 340 at 18µm 60-80 Silver:Silver Chloride 70:30 fine line printing capability
C2090225P7 81-83 3.5-7.0 500 at 16µm 60-80 Silver:Silver Chloride 70:30 slow drying solvents for longer screen life
C2131016D1 82-84 7.0-9.0 <40 at 25µm 150 Silver:Silver Chloride 70:30 a cross linked material with high chemical resistance
C2130429D3 81-83 2-5.5 <30 at 20µm 60-80 Silver:Silver Chloride Paste 80:20
C2140310D1 81.14-83.14 2-5.0 <40 at 20µm 60-80 Silver:Silver Chloride Paste 80:20 improved wetting, with a lower contact angle
C2080409D2 81-83 3.5-7.0 200 at 20µm 60-80 Silver:Silver Chloride 85:15
C2130916D5 81-83 2-5.5 <25 at 20µm 60-80 Silver:Silver Chloride 90:10 most conductive member of the series
C2130823D1 80.0-82.0 5.0-9.0 <90 at 25µm 130-150 Silver:Silver Chloride 90:10 high adhesion on ceramic substrate

Silver Based Low Temperature Systems

Section 7

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq @ 25µm

Curing

Temperature degree C

Properties
EMD5800

Silver content 40 - 50%

6-8 cPs

@ 25ºC

6-25uΩ.cm 100-150ºC Nanosilver for inkjet printing.
EMD5805

Silver content 60 - 65%

17-20 cPs @ 25ºC

5-25uΩ.cm 100-150ºC Nanosilver for aerosol jet.
C2121022D1 62.5-63.5 4-6 60 60-100 Silver paste for rotary screen printing.
C2080415P2 44.7-45.25 1.6-0.59 15-20 130-150 Conductive Silver polymeric paste.
C2081126P2 64.5-65.5 1.1-0.9 10-15 130-150 High conductivity silver polymeric paste.
C2110817D5 64.5-65.5 22-27 25-35 130-150 High strength silver polymeric paste.
C2100211D1 69-71   40 60-200 Silicone based silver conductive paste for screen printing, stable at 250°C.
C2080929D1 69-71     150-250 Silicone based silver conductive paste for syringe dispensing, stable at 250°C.
C2130702D2 94-95 35-45 0.528 Ohms/sq 200 High temperature silver Polymer paste (up to 200°C) designed for solder replacement.
2 - Pack Silver Conductive Adhesive 69-71   36 80-120 One silver epoxy resin paste and one silver epoxy hardner paste to be mixed in a 1:1 ratio.
C2090819P2 58-59 8-10.5 100 130 Silver thermoset conductive adhesive for a wide range of applications giving excellent chemical solvent and abrasion resistance and good adhesion.
C2011009P1 72-78 4-7   150
C2180423D2 55.69—57.69 7-10 25 150
C2100203D2 57-59 6.5-8.5 40 130-180
C2010903P2 64-66 15-22   200
C2020425D1 74-76 8-13   200
C2091104D1 75-80 3-5   150
C2040712D5       130-150 Organo-metallic silver ink for ink jet applications.
C2111027D14 71.5-72.5 22-27 15-25 130-150 High conductivity thermoplastic silver paste.
C2180423D2 55.69—57.69 7-10 25 150 Flexible silver paste for use in electro luminescent systems.
C2121218D1 51.5-53.5 1.4-2.0 100 130 Flexible silver paste (low viscosity) for use in electro luminescent systems.
C2020711D3 73-77 31-37   200 Stencil printing silver thermoset conductive adhesive.

Silver Based Firing Systems

Section 8

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
C2060217P3 75.2-76.3 11-18   550-625 Lead free Silver top coat paste.
C2000107P3 71.1-71.7 10.8 -11.8   700-800 Silver paste for PZT application.
C2050926P2 70-73 7.5-9.5 6 at 15µm 700-800 Lead free termination paste for single layer PZT ceramics.
C2010809D3 84-86 7-9   850 Silver paste designed for printing via fill.
C2050303D1 69-71 14-16 2.1 at 18µm 700 Fine lines printing Silver paste.
C2010515D4 79-81 10-15 2.1 at 18µm 850 Low cost screen printing internal electrode silver paste.
C2010829D2 78-81 17-22 2.5 at 21µm 850 High definition silver paste for LTCC tape.
C2140520D2 69-71 18-20 2 at 25µ 700 Silver paste for fine line printing (down to 50 micron line and spaces).

Gold Based Low Temperature Cure Systems

Section 9

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature degree C

Properties
C2041206P2 80-83 12-18 110 at 27µm 60-180 Screen printable gold polymer paste for applications in electrochemical sensors.

Gold Based High Temperature Firing Systems

Section 10

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
G2020520D1 15 17-22 220 at 0.3µm 780-800 Gold metallo-organic ink suitable for electrochemical sensors applications.
C2090908D1 80-82 56-62   700 Screen printing gold paste designed for high printing definition electrodes in sensor applications.

C2071218D1

79-81 4.5-7.5   750-850 Screen printing gold paste suitable for firing on to high temperature substrates.

C2090415D1

Not available (under re-formulation)

82-84 25-33   750-850 Screen printing gold paste suitable for firing on to high temperature substrates.

C1991025D2

Not available (under re-formulation)

81.5-84.5 35-50   750-850 Screen printing gold paste generating a porous final gold electrode after firing.

C2090428D4

Not available (under re-formulation)

81.5-83.5 25-40   750-850 Screen printing gold paste generating a porous final gold electrode after firing.

Platinum Based Low Temperature Systems

Section 11

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

Ohm/sq

Curing

Temperature degree C

Properties
C2050804P9 83-87 14-22 0.59Ω at 47µm 80-130 Polymeric platinum paste suitable for electrochemical sensors.
C2020322P6 85.5-86.5 10-15 0.29Ω at 25µm 130-180 Thermoset platinum paste suitable for electrochemical sensors.

Platinum Based Firing Systems

Section 12

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
61-62 7-11   1100-1450 Platinum paste suitable for internal electrode, for use on PVB tape.
C2010309P3 73.75-74.24 3.5-6   1150-1250 Platinum paste suitable for fiiring applications on electro-ceramic substrates.
C2000904P3 69.25-70.25 9.1-18.8   850 Low shrinkage, high adhesion firable Platinum paste..
C2011004P5 78.9-79.1 0.13-2.58   1000-1300 Firable Platinum paste for oxygen detection.
73.5-74.5 51-61 110 at 7.5µm 780-800 Firable Platinum paste suitable as working electrode in electrochemical sensors.

Alloy Based Firing Systems

Section 13

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
C2061103P7   11 - 16 7.1 at 21µm related to the properties of the ceramic Lead free silver zinc basecoat paste.
C2060217P3 75.2 - 76.3 11 - 18 3.4 x 10-6 Ohm.cm 550-625 Lead free silver topcoat paste.
C2061206D1 58 14.7-16.2   related to the properties of the ceramic Lead free silver zinc one part paste for coating barium titanate PTC ceramics.
C2100318D2 58 14.7-16.2   560-630 Lead free silver zinc one part paste for coating barium titanate PTC ceramics.
C2090512D1 49-51 4.4   850-1150 70:30 Ag:Pd paste for internal electrode PVB tape.
C2050830D8 56.5 - 57.5 12-15 17 at 9µm 850-1150 Lead free solderable Ag:Pd 80:20.
C2050905D3 56.5 - 57.5 12-15 17 at 9µm 850-1150 Lead free solderable Ag:Pd 80:20 designed for use in single layer PZT applications.

Palladium Based Firing Systems

Section 14

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
C2031105P2 67-68 15-18   850 Palladium paste firable onto ceamic substrate suitable for SOFC applications.

Copper Based Systems Low and High Temperature Cure

Section 15

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Drying / Firing Temperature degree C

Properties
C2100419D1 74-76 28-32 9 Dry at 150 High temperature screen printable Copper paste for use in termination and circuit printing on ceramic substrate.
C2140723D1 26 13 cps 8-9 Dry at 50

Ink Jettable nanocopper ink formulated to enable manufacture of electronic circuitry for use in applications such as OLED, solar cell and display.

Drying process: Dry for one hour at 50ºC in a vacuum oven. Also compatible with IR drying.

Laser cured or formic acid processing.

Substrate: ITO coated glass and glass.

C2130128D3 20 30 cps 13-15 Dry at 50

Ink Jettable nanocopper ink designed for flexible printed circuit boards.

Drying process: Dry for one hour at 50ºC in a vacuum oven. Also compatible with IR drying.

Laser precision sintering (LAPS)

Xenon flash lamp

Formic acid processing

Substrate: Polyamide

C2160617D1 70-80 10-30 9-10 Dry at 80

Nanocopper based paste for low temperature curing applications typically used in the following markets: Textiles, Sensors, Antenna and Lighting.

Typical drying conditions: 80ºC for 10 mins under an IR lamp. Also compatible with Vacuum oven.

Typical sintering conditions: convection oven with a reducing atmosphere <210ºC

Substrate: PET, ceramics, fabrics, FR4 and coated glass.

C2160617D2 70 20-25 20 Dry at 80

Nanocopper based paste for metallisation in thin film solar cells.

Typical drying conditions: 80ºC for 10 mins under an IR lamp. Also compatible with Vacuum oven.

High speed laser curing.

Substrate: PV metallisation layer.

Aluminium Based Firing Systems

Section 16

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Firing Temperature degree C

Properties
C2030217P2 67-72 10.5-14   780-910 The material gives good ohmic contact on Barium Titanate.
C2030304D2 64-66 3.4-4.3   780-840 Paste suitable for large volume printing.
C2100303D2 52 13-17   700-720 A low temperature firable paste.
C2100217D1 68-72 11-18   780-910 Paste suitable for large volume printing.

High Brightness Phosphor Pastes

Section 17

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Lamp Color

Curing

Temperature degree C

Properties
C2180612D1 78.5-82.5 0.86-2.5 White 130 Phosphor paste, excellent adhesion onto ITO, chemical and environmental resistance- produces White Lamp.
C2070209P5 78.5-82.5 0.86-2.5 Green 130 Phosphor paste, excellent adhesion onto ITO, chemical and environmental resistance - produces Green Lamp.
C2070126P4 78.5-82.5 0.86-2.5 Orange 130 Phosphor paste, excellent adhesion onto ITO, chemical and environmental resistance - produces Orange Lamp.
C2061027P15 80-82.5 0.86-2.5 Blue 130 Phosphor paste, excellent adhesion onto ITO, chemical and environmental resistance - produces Blue Lamp.
C2061027P13 75-83 0.71-2.15 Blue/Green 130 Phosphor paste, excellent adhesion onto ITO, chemical and environmental resistance - produces Blue/Green Lamp.
C2080211P2 77.5-81.5 0.86-2.5 White 130 Phosphor paste that gives White lamp when used in conjunction with D2090130P5 dielectric ink.

Dielectric and Insulating Firing Systems

Section 18

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature degree C

Properties
D2020409P8 69.5-70.5 20-25 N/A Dry at 150 Dielectric paste suitable as insulation layer when printed and fired onto stainless steel substrate.

Insulating Low Temperature Based Systems

Section 19

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature

Properties
D2080121P12 47-48 9.5-14 N/A 150 Thermoplastic screen printable, flexible white insulation paste.
D2090126D1   15-20 N/A 60 - 200 Silicone based screen printing black insulation paste stable at T of 250C.
D2090124D2   15-20 N/A 60-200 Silicone based screen printing green insulation paste stable at T of 250C.
D2090130P5 73-75 1.0-2.2 N/A 130 Thermoset pink insulation paste.
D2070423P5 43-45 16-16 N/A 80-130 Grey coloured screen printable polymer insulation paste.
D2071120P1 39-41 5-6 N/A 80-130 Blue coloured screen printable, flexible polymer insulation paste.
D2140114D5 70-72 2.0-4.0 N/A 80-150 Blue coloured screen printable polymer insulation paste designed for resistance to water ingress.
D2020823P2 71.3-73.3 2.0-6.0 N/A 80-150 Blue coloured screen printable polymer insulation paste designed for maximum resistance to water ingress.
D50706P3   5.5-8 N/A 60-80 Blue coloured screen printable, flexible polymer insulation paste with high resistance to solvent attack.
D2030210D1 45-47 6-9 N/A 60-80 Black coloured screen printable, flexible insulation paste.
D2070412P3 44.5-45.5 11-15 N/A 80-130 Green coloured screen printable, flexible insulation paste.
D2081009D6 34.5-35.5 13-17 N/A 80-130 Transparent green coloured screen printable, flexible insulation paste.
D50706D2 43-45 5-7 N/A 80 Cream coloured screen printable, flexible insulation paste resistant to most solvent attack.
D2130510D2 75.0-78.0 10.0-14.0 N/A 130 White coloured screen printable, flexible, thermoset insulation paste.
D2140423D2 41.5-42.5 5.0-9.0 N/A 60-100 Blue coloured rotary screen printing, thermoset insulation paste.

Dielectric Low Temperature Based Systems

Section 20

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature degree C

Properties
D2070209P6 73.5-76.5 1.4-2.3 N/A 130 Thermoset white dielectric paste.
D2090130P5 72.5-76.5 1.2-2.2 N/A 130 Thermoset pink dielectric paste.
D2120521D1 73.6-74.6 1.4-1.9 N/A 130 Thermoset white EL dielectric paste low viscosity.
D2121112D17 73.5-76.5 1.4-2.3 N/A 130 Thermoset pink dielectric paste low viscosity.

UV Curable Products

Section 21

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Cured

thickness

Typical

curing

conditions

Properties
C2140221D5 N/A 1.0-3.0
Typically 4µ
See product datasheet for information UV curable carbon conductor ink designed for printing onto polymeric substrates using flexographic printing.
D2150901D1 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 450mJ/cm2 is necessary to cure.

UV Clear Dielectric Paste, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.
D2150901D2 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 200-400mJ/cm2 is necessary to cure.

UV curable translucent green dielectric, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.
D2150914D1 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 200-400mJ/cm2 is necessary to cure.

UV curable translucent white (gloss finish) dielectric, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.
D2150914D2 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 200-400mJ/cm2 is necessary to cure.

UV white dielectric paste, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.
D2151013D1 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 200-400mJ/cm2 is necessary to cure.

UV curable translucent yellow dielectric, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.
D2151013D2 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 200-400mJ/cm2 is necessary to cure.

UV curable translucent red dielectric, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.
D2151013D3 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 200-400mJ/cm2 is necessary to cure.

UV curable translucent deep blue dielectric, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.
D2151013D4 95-98 1.5-2.5

Typically

8-10µ

Cure in a UV conveyor curer. An UV dose of 200-400mJ/cm2 is necessary to cure.

UV curable translucent black dielectric, suitable for electronic applications e.g. electroluminescent, biosensors and other circuits.

C2140326D1

Not available at the moment. Product is undergoing further development.

71.5-72.5 1.0-3.0
Typically 4µ
See product datasheet for information

UV curable silver conductor paste designed for printing onto polymeric substrates using flexographic printing at speeds up to 60m/min.

C2110414D7

Not available at the moment. Product is undergoing further development.

71.5-72.5 6.0-3.0
Typically 4µ

See product datasheet for information

UV curable silver conductor paste designed for printing onto polymeric substrates using flexographic printing at speeds up to 13m/min.

Binder Low Temperature Systems

Section 22

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing

Temperature degree C

Properties
R2070613P2 37.5-40.4 0.15-0.33 N/A 130 Thermoset resin solution designed specifically for electroluminescent systems.

Paste systems for Recyclable Substrates

Section 23

       

Paste

Number

Solids

Content

Viscosity

Pa.s.

Resistivity

mOhm/sq

Curing Temperature degree C

Properties
R2090706D2
63-65% 9-13.5 N/A 50/120 Substrate Adhesive.
R2100422D1 80-83% 11-22 N/A 50/120 Substrate Adhesive High Tack.
D2080121P12 47-48% 9-14 N/A 150 min Dielectric for the system.
C2110310D3 59-61 35-60 <2 ohm/sq

130-180

30min

Silver based Stencil printing adhesive.
C2110716D2 59.5 61.5 16.5- 20.0 <300mohm/sq

130-180

30min

Silver based Screen Printable adhesive.
64.5-65.5 1.1-0.9 10-15 mohm/sq

130-180

30min

Silver based Screen Printable conductor.

Please contact us for these new products by using our Online Form or email direct to

GBPP-Sales@sunchemical.com