Termination Materials for Ceramic Materials

PZT Devices

Termination materials for single and multilayer structures are formulated for application by dipping, spraying or screen printing.

These materials are especially compounded to resist migration after poling. Systems are also available for Logomechanical contact use or contacting by soldering. The normal pastes are designed to fire in the region of 600°C to 900°C.

  • Pastes are available to fire at lower temperatures to suit the newer ceramic materials also metallo-organic systems have been used to give thin layers on other Ferro-electric components.
  • Pastes have been formulated for low temperature composite systems these are used both as temporary and permanent electrodes.

C2100419D1 - Copper Ink

C2000107P3 - Silver Ink PZT

C2050926P2 - Silver (Pb free) Ink PZT - Lead free termination for single layer PZT ceramics

Please Contact us for these new products by using our Online Form or Email direct to sales@gwent.org

Varistors

Precious metal or base metal pastes can be formulated to suit the specific requirements of the varistor manufacturer. The materials are custom designed to suit the individual varistor oxide mixture the adhesion mechanism is then adjusted accordingly. These can be provided in a number of different application media.

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PTC Thermistors - Paste systems containing Aluminium

C2030217P2 - Aluminium Ink PTC Good stain resistance

C2030304D2 - Aluminium Ink PTC Large volume Printing

C2100303D2 - Aluminium Ink for PTC low fire 700 deg C

C2100217D1 - Aluminium Ink for PTC For high volume and good stain resistance

These inks fire in air over the range of 600°C to 950°C. They are of high conductivity and can be contacted onto by silver loaded adhesives, fired silver films or mechanical contact. Logo

PTC Thermistors - Paste systems containing Silver

C2060217P3 - Silver Ink (top coat )Ink for PTC

C2061103P7 - Silver/Zinc ( Base Coat ) Ink for PTC

C2061206D1 - Silver/Silver Zinc (Pb Free) Ink PTC

C2100318D2 - Silver/Silver Zinc One part Ink 58% Ag for PTC

These materials are especially formulated with additives to give stable electronic response. The systems are normally two parts, a contacting layer and a connection layer. The second layer may be produced in a solderable form if required. A typical two part system is a base layer and a top coat. Please contact us for
information about one part systems. Pastes and adhesives for bonding the PTC device to the external circuitry or mounting system are available. Pastes are also available to contact onto PTC devices that have been initially coated by other techniques i.e. sputtering.

Please Contact us for these new products by using our Online Form or Email direct to sales@gwent.org

NTC Thermistors

Termination Inks are formulated for ceramic based NTC Thermistors.

These can be compounded for dipping/spraying or screen printing applications. By selection of the adhesion agents various firing temperatures can be obtained.

  • Base metal inks that are air fireable are currently under investigation.
  • New high temperature termination systems for NTC's designed to operate over 1000°C

C2071218D1 - Gold Ink for NTC

C2010309P3 - Platinum (high stability) Paste NTC

Please Contact us for these new products by using our Online Form or Email direct to sales@gwent.org

Ceramic Capacitors

Silver containing pastes are formulated for ceramic capacitors where soldering is a requirement. Variations are also available to cover those applications which require a minimal coating of silver paste which after firing on is electroplated to give the solderable contact. Alternatively base metal formulations are available where mechanical contact or over-printing with Silver is required.

Please Contact us for these new products by using our Online Form or Email direct to sales@gwent.org

Tantalum Capacitors

Our range of materials for Tantalum capacitors covers the whole materials requirement of the Tantalum capacitor manufacturer.

These include:

  • Manganese dioxide dipping systems. (Contact us for information)
  • Carbon or graphite based inks to make the initial contact onto the tantalum electrode, normally this is a dipping system, but other variations can be manufactured.
  • Silver or Silver/base metal electrode dipping systems. A typical Silver system is availible
  • Silver adhesive materials for chip Tantalum applications. These systems are designed to adhere the chip tantalum device to the lead frame and resist the subsequent moulding procedures.

Please Contact us for these new products by using our Online Form or Email direct to sales@gwent.org

Tubular Capacitors

Dipping or spraying formulations can be formulated for tubular capacitors. These materials are usually Silver containing and are solderable. However, if other metal systems are required these can be easily incorporated. Variations are also available to cover those applications which require a minimal coating of silver paste which after firing on is electroplated to give the solderable.

Please Contact us for these new products by using our Online Form or Email direct to sales@gwent.org